What we do
Analytical Services
Six techniques, one lab. Pick a service to see what it shows and when we use it.
Gideon Analytical provides a variety of techniques which allow us to be the most advanced failure analysis house with electrical components, printed circuit boards, materials, quality control, vendor inspection, and understanding component processes. We design, debug and review electrical schematics, in addition to matching the failure with a design, application, process, manufacturing, or environmental issue. We have over 35 years experience in this area.
Scanning Electron Microscopy (SEM)
Surface topography to 250,000×, EDS elemental analysis and EBIC imaging of components, boards and materials.
Read more →X-Ray Radiography
Nondestructive inspection of solder joints, voids, cracks, delamination and sealed packages.
Read more →Fourier Transform Infra-Red
Identification of organic contamination, flux residues, polymers and extractables.
Read more →X-Ray Fluorescence Spectrometry (XRF)
Nondestructive elemental analysis of solids, powders and liquids, including plating and alloys.
Read more →X-Ray Diffraction
Crystalline phase identification and structural analysis of polycrystalline materials.
Read more →Thermal Analysis
TMA, DSC and TGA to characterize materials as a function of temperature.
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