Gideon Analytical Laboratories received several ball grid arrays (BGAs) to specifically look for any shorts, opens, cracks, or contamination issues that were preventing its operation. Radiography analysis was requested. A BGA is a type of surface-mount packaging (a chip carrier) used for integrated circuits. They come in two basic types: plastic ball grid arrays (PBGAs) and ceramic ball grid arrays (CBGAs). BGA packages are used to permanently mount devices such as microprocessors.