Failure Analysis

Failure analysis finds out why an electronic part or assembly stopped working. The goal is a root cause that you can use to make a corrective action, for example a change to a design, a process or a supplier.

This category collects our case studies on many kinds of electronic parts. They include capacitors, diodes, transistors, integrated circuits, optocouplers and complete printed circuit boards. The common failure causes are electrical overstress (EOS), mechanical stress and cracking, moisture, contamination and process defects. In one case, a short on a board was caused by tin whiskers inside the solder mask. In another, cracks in ceramic capacitors came from PCB flexing.

A typical job starts with a review of the failure history and electrical tests on the failed parts, often compared with good parts. The lab then uses non-destructive methods such as X-ray radiography. Destructive steps follow, such as cross-sectioning and decapsulation, with optical and scanning electron microscopy. Chemical methods such as FTIR help to identify contamination.

To start a project, request a quote.