IC Failure Analysis (Integrated Circuit)

An integrated circuit (IC) is an electronic circuit on one small chip, or die, of semiconductor material, normally silicon. An IC can have several billion transistors and other components on one die. The trace line width of each conductor gets smaller as technology advances, so small defects have a larger effect.

ICs fail for many reasons. Electrical overstress (EOS) and electrostatic discharge (ESD) can damage metal and oxide on the die. Contamination and moisture inside the package can cause leakage. Cracks, delamination and bond-wire damage can come from mechanical or thermal stress. Process defects in the die or the package can also cause failures in the field.

The case studies in this category cover logic ICs, a DSP, gate drivers, voltage regulators and optocouplers. They include a CMOS gate with its supply line pulled down, and optocouplers with internal contamination.

The lab starts with electrical tests and curve tracing, then uses X-ray radiography to look at the package without damage. Next we decapsulate the part and examine the die with optical microscopy and scanning electron microscopy.

If you have failed ICs, request a quote.