A printed circuit board (PCB), also called a printed wiring board (PWB), holds electronic parts and connects them with copper traces, pads and plated through holes. Boards are inspected and classified to IPC standards, and Class 3 is the highest class. Each class sets limits for manufacturing defects.
PCB problems can come from the bare board or from assembly. Common failure modes include voids in plated through holes that cause opens, contamination that causes leakage or corrosion, and solder joint defects such as voiding in ball grid arrays (BGAs). Flexing during depanelization can also crack parts. Overheating and fires, and tin whiskers that cause shorts, are other cases.
The case studies in this category include a board with an open plated through hole and a board with a short caused by tin whisker growth in the solder mask. Others show BGA voiding, and flex damage to ceramic capacitors.
The lab uses X-ray radiography to look inside solder joints and vias. We use cross-sectioning with optical microscopy to check plating and layers. FTIR and scanning electron microscopy help to identify contamination.
To discuss a failed board, request a quote.
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April 18, 2013
